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TSS461 Datasheet(PDF) 2 Page - TEMIC Semiconductors

Part No. TSS461
Description  Van Controller Serial Interface
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Maker  TEMIC [TEMIC Semiconductors]
Homepage  http://www.temic.de
Logo TEMIC - TEMIC Semiconductors

TSS461 Datasheet(HTML) 2 Page - TEMIC Semiconductors

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Qualpack TS80C31X2/C32X2
2
Rev. 2 – January 1999
1. Contents
1. Contents........................................................................................................................................................ 2
2. General Information ..................................................................................................................................... 3
3. Technology Information .............................................................................................................................. 4
3.1 WAFER PROCESS TECHNOLOGY ..................................................................................................................... 4
3.2 PRODUCT DESIGN .......................................................................................................................................... 5
3.3 PACKAGE TECHNOLOGY ................................................................................................................................. 6
3.3.1 SOIC.300 16 leads............................................................................................................................... 6
3.3.2 Other available packages .................................................................................................................... 7
3.4 TEST ............................................................................................................................................................. 7
3.5 DEVICE CROSS SECTION ................................................................................................................................8
3.6 WAFER PROCESS CONTROL ........................................................................................................................... 9
4. Qualification ............................................................................................................................................... 10
4.1 CHANGE PROCEDURE................................................................................................................................... 11
4.2 QUALIFICATION FLOW ................................................................................................................................... 12
4.3 WAFER PROCESS QUALIFICATION ................................................................................................................. 13
4.4 PACKAGE QUALIFICATION ............................................................................................................................. 14
4.5 DEVICE QUALIFICATION ................................................................................................................................16
4.5.1 ESD and Latch-up results .................................................................................................................. 17
4.5.2 Failure Mechanisms and Corrective Actions ..................................................................................... 17
4.5.3 Qualification status............................................................................................................................. 17
4.6 OUTGOING QUALITY AND RELIABILITY............................................................................................................ 18
4.6.1 AOQ (Average Outgoing Quality) ...................................................................................................... 18
4.6.2 EFR (Early Failure Rate).................................................................................................................... 19
4.6.3 LFR (Latent Failure Rate) .................................................................................................................. 19
5. User Information ........................................................................................................................................ 20
5.1 SOLDERING RECOMMENDATIONS .................................................................................................................. 20
5.2 DRY PACK ORDERING RULES ..................................................................................................................... 20
5.3 ESD CAUTION.............................................................................................................................................. 20
6. Environmental Information ....................................................................................................................... 21
7. Other Data................................................................................................................................................... 22
7.1 ISO9001 APPROVAL CERTIFICATE................................................................................................................ 22
7.2 DATABOOK REFERENCE................................................................................................................................23
7.3 ADDRESS REFERENCE.................................................................................................................................. 23
8. Revision History......................................................................................................................................... 24


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