Electronic Components Datasheet Search |
|
TSS461 Datasheet(PDF) 15 Page - TEMIC Semiconductors |
|
TSS461 Datasheet(HTML) 15 Page - TEMIC Semiconductors |
15 / 24 page Qualpack TSS463 / TSS461C Rev. 2 – January 1999 15 Lot Number Device Type Test Description Step Result Comment Z20569K HMT-65664A in SO 28 (2) Thermal Cycles 500c 1000c 0/45 0/45 85/85 Humidity 500h 1000h 2000h 0/45 0/45 0/45 Resistance to Soldeting Heat Level 1 0/10 Marking Permanency - 0/3 HAST after Soldering Stress (with 5.5v bias) 168h 0/45 Global All products Mounting Stress level 1 Elect. 0/255 0 ppm Climatic Tests - 0/720 0 % Notes: (1) SUMITOMO 6300 molding compound (2) NITTO MP8000 molding compound (3) Electrical test with Quality program at 25°c, 125°c and -40°c (4) Performed on molded device opened using acid (5) No Lifted Ball Bond, breakdown observed on wires (83%) and over the stich (17%) |
Similar Part No. - TSS461 |
|
Similar Description - TSS461 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |