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HT48R01T3 Datasheet(PDF) 10 Page - Holtek Semiconductor Inc |
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HT48R01T3 Datasheet(HTML) 10 Page - Holtek Semiconductor Inc |
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10 / 16 page  Power-on Reset Characteristics Ta=25 °C Symbol Parameter Test Conditions Min. Typ. Max. Unit VDD Conditions VPOR VDD Start Voltage to Ensure Power-on Reset ¾¾ ¾ ¾ 100 mV RRVDD VDD raising rate to Ensure Power-on Reset ¾¾ 0.035 ¾¾ V/ms VPOR MAX Maximum VDD Start Voltage to Ensure Power-on Reset ¾ Ta=25 °C, without 0.1 mF between VDD and VSS 0.9 ¾ 1.5 V Ta=-40 °C~85°C, without 0.1 mF between VDD and VSS 0.6 ¾ 1.8 V tPOR Power-on Reset Low Pulse Width ¾ without 0.1 mF between VDD and VSS 2 ¾¾ ms without 0.1 mF between VDD and VSS TBD ¾¾ ms Functional Description As these device packages contain different chips, for a detailed functional description, users must refer to the relevant datasheets for the related MCU. The following table shows which individual devices are inside each package. Device MCU HT48R01T3 HT48R01B HT46R01T3 HT46R01B Multi-chip Internal Devices The MCU controls the RF transmitter via a two line interface using two of its I/O pins, PB0 and PB1. Pin PB1, which should be setup as an output by the MCU, is used to generate the encoding data. Pin PB0, which should be setup as an input by the MCU, is used for synchronising purposes. There are some special considerations which need to be taken into account when using these devices. These points will be mentioned in the hardware and software consideration sections. Hardware Considerations As these devices are composed of an individual MCU and RF Transmitter, using them together requires the user to take care of some special points. Rev. 1.30 10 November 23, 2010 HT46R01T3/HT48R01T3 8-Bit OTP MCU with RF Transmitter T i m e V D D V P O R R R V D D t P O R |
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