STM32L011X3 datasheet(7/115 Pages) STMICROELECTRONICS

Part #	STM32L011X3

Description	Access line ultra-low-power 32-bit MCU ARM-based Cortex-M0, up to 16KB Flash, 2KB SRAM, 512B EEPROM, ADC

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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7 / 115 page

List of figures

STM32L011x3/4

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List of figures

Figure 1.

STM32L011x3/4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 2.

Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 3.

STM32L011x3/4 LQFP32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 4.

STM32L011x3/4 UFQFPN32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 5.

STM32L011x3/4 WLCSP25 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 6.

STM32L011x3/4 UFQFPN28 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 7.

STM32L011x3/4 UFQFPN20 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 8.

STM32L011x3/4 TSSOP20 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 9.

STM32L011x3/4 TSSOP14 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 10.

Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figure 11.

Pin loading conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Figure 12.

Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Figure 13.

Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 14.

Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 15.

IDD vs VDD, at TA= 25 °C, Run mode, code running from

Flash memory, Range 2, 16 MHz HSE, 1WS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Figure 16.

IDD vs VDD, at TA= 25 °C, Run mode, code running from

Flash memory, Range 2, HSI16, 1WS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Figure 17.

IDD vs VDD, at TA= -40/25/55/ 85/105/125 °C, Low-power run mode,

code running from RAM, Range 3, MSI (Range 0) at 64 KHz, 0 WS . . . . . . . . . . . . . . . . . 58

Figure 18.

IDD vs VDD, at TA= -40/25/55/ 85/105/125 °C, Stop mode with RTC enabled

and running on LSE Low drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Figure 19.

IDD vs VDD, at TA= -40/25/55/85/105/125 °C, Stop mode with RTC disabled,

all clocks OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Figure 20.

High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Figure 21.

Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Figure 22.

Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Figure 23.

HSI16 minimum and maximum value versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . 67

Figure 24.

VIH/VIL versus VDD (CMOS I/Os) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Figure 25.

VIH/VIL versus VDD (TTL I/Os) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Figure 26.

I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Figure 27.

Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Figure 28.

ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Figure 29.

Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Figure 30.

SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Figure 31.

SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

Figure 32.

SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

Figure 33.

LQFP32, 7 x 7 mm, 32-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . 93

Figure 34.

LQFP32 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Figure 35.

Example of LQFP32 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Figure 36.

UFQFPN32, 5 x 5 mm, 32-pin package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Figure 37.

UFQFPN32 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Figure 38.

Example of UFQFPN32 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Figure 39.

WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Figure 40.

WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Figure 41.

Example of WLCSP25 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

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