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6125FF2-R Datasheet(PDF) 6 Page - Cooper Bussmann, Inc. |
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6125FF2-R Datasheet(HTML) 6 Page - Cooper Bussmann, Inc. |
6 / 6 page Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4326 BU-SB15120 December 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. 6125FF Fast-acting subminiature fuses Technical Data 4326 Effective December 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Wave solder profile Reference EN 61760-1:2006 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100°C 100°C • Temperature typ. (Tstyp) 120°C 120°C • Temperature max. (Tsmax) 130°C 130°C • Time max. (Tsmin to Tsmax) (ts) 70 Seconds 70 Seconds ∆ preheat to max Temeperature 150°C max. 150°C max. Peak temperature (Tp) 235°C - 260°C 250°C - 260°C Peak package body temperature (TP)* Table 1 Table 2 Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25°C to 25°C 4 minutes 4 minutes Tsmin Tsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area Time |
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