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TCA9548ARGER Datasheet(PDF) 4 Page - Texas Instruments |
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TCA9548ARGER Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page 4 TCA9548A SCPS207F – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: TCA9548A Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage –0.5 7 V VI Input voltage(2) –0.5 7 V II Input current –20 20 mA IO Output current –25 mA ICC Supply current –100 100 mA Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 6.3 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage 1.65 5.5 V VIH High-level input voltage SCL, SDA 0.7 × VCC 6 V A2–A0, RESET 0.7 × VCC VCC + 0.5 VIL Low-level input voltage SCL, SDA –0.5 0.3 × VCC V A2–A0, RESET –0.5 0.3 × VCC TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TCA9548A UNIT PW (TSSOP) RGE (VQFN) 24 PINS 24 PINS RθJA Junction-to-ambient thermal resistance 108.8 57.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.1 62.5 °C/W RθJB Junction-to-board thermal resistance 62.7 34.4 °C/W ψJT Junction-to-top characterization parameter 10.9 3.8 °C/W ψJB Junction-to-board characterization parameter 62.3 34.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 15.5 °C/W |
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