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OPA170-Q1, OPA2170-Q1, OPA4170-Q1

www.ti.com

SBOS834 – DECEMBER 2016

Product Folder Links: OPA170-Q1 OPA2170-Q1 OPA4170-Q1

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.4 Thermal Information: OPA170-Q1

OPA170-Q1

UNIT

D (SOIC)

DBV (SOT-23)

DRL (SOT)

8 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

149.5

245.8

208.1

°C/W

Junction-to-case (top) thermal resistance

97.9

133.9

0.1

°C/W

Junction-to-board thermal resistance

87.7

83.6

42.4

°C/W

Junction-to-top characterization parameter

35.5

18.2

0.5

°C/W

Junction-to-board characterization parameter

89.5

83.1

42.2

°C/W

Junction-to-case (bottom) thermal resistance

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.5 Thermal Information: OPA2170-Q1

OPA2170-Q1

UNIT

D (SOIC)

DCU (VSSOP)

DGK (VSSOP)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

134.3

175.2

180

°C/W

Junction-to-case (top) thermal resistance

72.1

74.9

55

°C/W

Junction-to-board thermal resistance

60.6

22.2

130

°C/W

Junction-to-top characterization parameter

18.2

1.6

5.3

°C/W

Junction-to-board characterization parameter

53.8

22.8

120

°C/W

Junction-to-case (bottom) thermal resistance

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.6 Thermal Information: OPA4170-Q1

OPA4170-Q1

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

93.2

106.9

°C/W

Junction-to-case (top) thermal resistance

51.8

24.4

°C/W

Junction-to-board thermal resistance

49.4

59.3

°C/W

Junction-to-top characterization parameter

13.5

0.6

°C/W

Junction-to-board characterization parameter

42.2

54.3

°C/W

Junction-to-case (bottom) thermal resistance

—

—

°C/W