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B32672L1682 Datasheet(PDF) 30 Page - TDK Electronics |
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B32672L1682 Datasheet(HTML) 30 Page - TDK Electronics |
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30 / 39 page  1.2 Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A. Conditions: Series Solder bath temperature Soldering time MKT boxed (except 2.5 × 6.5 × 7.2 mm) coated uncoated (lead spacing > 10 mm) 260 ±5 °C 10 ±1s MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) 5 ±1s MKP MKT (lead spacing ≤ 7.5 mm) uncoated (lead spacing ≤ 10 mm) insulated (B32559) <4s recommended soldering profile for MKT uncoated (lead spacing ≤ 10 mm) and insulated (B32559) Immersion depth 2.0 +0/ 0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage ΔC/C 0 2% for MKT/MKP/MFP 5% for EMI suppression capacitors tan δ As specified in sectional specification B32671L ... B32672L High V AC, high temperature (wound) Page 30 of 39 Please read Cautions and warnings and Important notes at the end of this document. |
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