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RMB1F Datasheet(PDF) 1 Page - DIYI Electronic Technology Co., Ltd. |
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RMB1F Datasheet(HTML) 1 Page - DIYI Electronic Technology Co., Ltd. |
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1 / 2 page  ical Thermal Resistance per leg Plastic Material-UL Flammability 94V-0 Maximum reverse recovery time (Note 3) PHASE 0. RMB2F RMB4F RMB6F RMB8F RMB10F RMB1F Surge overload rating-30A peak RMB1F THRU RMB10F 30 Typ Forward Voltage per element @IF=1.0A 1.3 70 Mechanical Data Ideal for printed circuit board Designed for Surface Mount Application Features Glass Passivated Die Construction Low leakage SINGLE AMP FAST GLASS PASSIVATED BRIDGE RECTIFIER Rating at 25℃ ambient temperature unless otherwise specified. Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Maximum Ratings and Electrical Characteristics SYMBOL V RRM VRWM VDC VRMS 70 140 280 420 560 700 VFM RθJA RθJL TJ,TSTG Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) Peak Reverse Current @TA=25℃ At Rated DC Blocking Voltage @TA=125℃ Operating and Storage Temperature Range RMS Reverse Voltage -55to+150 ℃ uA Typical Junction Capacitance per leg 13 pF 20 ℃/W IR 5.0 500 A V IFSM UNITS V V IO A 1000 100 200 400 600 800 TYPE NUMBER ns 250 500 150 RR T · · · · · · Polarity: as marked on case · Mounting position: Any · Marking: type number · Lead Free: For RoHS / Lead Free Version, · Case: MB-F, molded plastic · Terminals: plated leads solderable per MIL-STD-202, Method 208 Average Rectified Output Current (Note 1)@TA=40℃ (Note 2)@TA=40℃ 0.5 0.8 8 4. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C. 3. Reverse Recovery Test Conditions: I Note:1. Mounted on glass epoxy PC board with 1.3mm 2 solder pad. 2. Mounted on aluminum substrate PC board with 1.3mm 2 solder pad. F =0.5A, IR=1.0A, IRR=0.25A CJ (Note4) 1 of 2 version:01 www.dyelec.com dimensions in inches and (millimeters) |
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