LTC5508

8

5508fa

LT/TP REV A 0603 1K • PRINTED IN USA

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

© LINEAR TECHNOLOGY CORPORATION 2002

RELATED PARTS

PART NUMBER

DESCRIPTION

COMMENTS

RF Power Controllers

LTC1757A

RF Power Controller

Single/Dual Band GSM/DCS/GPRS Mobile Phones

LTC1758

RF Power Controller

Single/Dual Band GSM/DCS/GPRS Mobile Phones

LTC1957

RF Power Controller

Single/Dual Band GSM/DCS/GPRS Mobile Phones

LTC4400

SOT-23 RF PA Controller

Single/Dual Band GSM/DCS/GPRS Phones, 45dB Dynamic Range, 450kHz Loop BW

LTC4401

SOT-23 RF PA Controller

Single/Dual Band GSM/DCS/GPRS Phones, 45dB Dynamic Range, 250kHz Loop BW

LT5500

1.8GHz to 2.7GHz RF Front End

Dual LNA gain Setting +13.5dB/–14dB at 2.5GHz, Double-Balanced Mixer,

1.8V

LT5502

400MHz Quadrature Demodulator with RSSI

1.8V to 5.25V Supply, 70MHz to 400MHz IF, 84dB Limiting Gain, 90dB RSSI Range

LT5503

1.2GHz to 2.7GHz Direct IQ Modulator and

1.8V to 5.25V Supply, Four-Step RF Power Control, 120MHz Modulation Bandwidth

Up Converting Mixer

LT5504

800MHz to 2.7GHz RF Measuring Receiver

80dB Dynamic Range, Temperature Compensated, 2.7V to 5.5V Supply

LTC5505

300MHz to 3.5GHz RF Power Detector

>40dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply

LT5506

500MHz Quadrature IF Demodulator with VGA

1.8V to 5.25V Supply, 40MHz to 500MHz IF, –4dB to 57dB Linear Power Gain

LTC5507

100kHz to 1GHz RF Power Detector

48dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply

LT5511

High Signal Level Up Converting Mixer

RF Output to 3GHz, 17dBm IIP3, Integrated LO Buffer

LT5512

High Signal Level Down Converting Mixer

DC-3GHz, 20dBm IIP3, Integrated LO Buffer

PACKAGE DESCRIPTIO

1.15 – 1.35

(NOTE 4)

1.80 – 2.40

0.15 – 0.30

6 PLCS (NOTE 3)

0.10 – 0.18

(NOTE 3)

SC6 SC70 0802

1.80 – 2.20

(NOTE 4)

0.65 BSC

PIN 1

0.80 – 1.00

1.00 MAX

0.00 – 0.10

REF

0.10 – 0.40

0.10 – 0.30

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE INDEX AREA

7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70

3.26 MAX

0.47

MAX

0.65

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

0.96 MIN

2.1 REF

1.16 REF

INDEX AREA

(NOTE 6)

SC6 Package

6-Lead Plastic SC70

(Reference LTC DWG # 05-08-1638)