NLU2GU04

www.onsemi.com

8

PACKAGE DIMENSIONS

ULLGA6 1.2x1.0, 0.4P

CASE 613AE

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

A

B

E

D

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

L

5X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

6X

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

L1

1

3

4

6

DIM

MIN

MAX

MILLIMETERS

A

−−−

0.40

A1

0.00

0.05

b

0.15

0.25

D

1.20 BSC

E

1.00 BSC

e

0.40 BSC

L

0.25

0.35

L1

0.35

0.45

NOTE 4

SOLDERMASK DEFINED*

DIMENSIONS: MILLIMETERS

0.26

5X

0.49

6X

1.24

0.53

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.40

1

MOUNTING FOOTPRINT

PKG

OUTLINE

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Europe, Middle East and Africa Technical Support:

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Phone: 81−3−5817−1050

NLU2GU04/D

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