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BD6722FS Datasheet(PDF) 10 Page - Rohm

Part No. BD6722FS
Description  Multifunction Single-phase Full-wave Fan Motor Driver
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Maker  ROHM [Rohm]
Homepage  http://www.rohm.com
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BD6722FS Datasheet(HTML) 10 Page - Rohm

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Datasheet
Datasheet
BD6722FS
TSZ02201-0H1H0B100180-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
28.JUL.2012 Rev.002
www.rohm.com
TSZ22111・15・001
●Power dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)
and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to
the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol
θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.22 shows the model of heat
resistance of the package. Heat resistance
θja, ambient temperature Ta, junction temperature Tj, and power consumption P
can be calculated by the equation below:
Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance
θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging
condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value
measured at a specified condition. Fig.23 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board
70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance
θjc from IC chip joint part to the package
surface part of mounting the above-mentioned same substrate is shown in the following as a reference value.
*Reduce by 6.5mW/°C over 25°C
(On 70.0mm x 70.0mm x 1.6mm glass epoxy board)
●I/O equivalence circuit(Resistance values are typical)
1) Power supply terminal,
2) Hall input terminals,
3) Minimum output duty setting
4) High side output 1, 2
and Ground terminal
Output duty controllable input
terminal
terminals,
terminal, and
Speed pulse signal output
Output current detection
terminal, and
terminal
Lock alarm signal output
terminal
5) Low side output 1, 2
6) Reference voltage output
7) Oscillating capacitor
terminals, and
terminal
connecting terminal
Output current detecting
resistor connecting terminal
500
750
Pd[mW]
0
25
50
75
100
125
150
Ta[°C]
250
812.5
θja=153.8 [°C/W]
θja = (Tj – Ta) / P [°C/W]
θjc = (Tj – Tc) / P [°C/W]
Fig.22 Thermal resistance
Fig.23 Thermal de-rating curve
θja = (Tj – Ta) / P [°C/W]
θjc = 43 [°C/W] (reference value)
Chip surface temperature Tj[°C]
Package surface temperature Tc[°C]
Power consumption P[W]
Ambient temperature Ta[°C]
TH
1k
H+
H–
CS
Vcc
20
FG
AL
A1H
A2H
Vcc
GND
MIN
1k
Vcc
30
A1L
A2L
RNF
REF
31k
Vcc
Vcc
OSC
Vcc
1k
Vcc
1k


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