NTD60N02R datasheet(1/8 Pages) ONSEMI

Part #	NTD60N02R

Description	Power MOSFET 62 A, 24 V, N-Channel, DPAK

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Manufacturer	ONSEMI [ON Semiconductor]

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December, 2004 − Rev. 10

1

Publication Order Number:

NTD60N02R/D

NTD60N02R

Power MOSFET

62 A, 24 V, N−Channel, DPAK

Features

• Planar HD3e Process for Fast Switching Performance

• Low R

DS(on) to Minimize Conduction Loss

• Low C

iss to Minimize Driver Loss

• Low Gate Charge

• Optimized for High Side Switching Requirements in

High−Efficiency DC−DC Converters

• Pb−Free Packages are Available

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

VDSS

24

Vdc

Gate−to−Source Voltage − Continuous

VGS

±20

Vdc

Thermal Resistance

Junction−to−Case

Total Power Dissipation @ TC = 25°C

Drain Current

Continuous @ TC = 25°C, Chip

Continuous @ TC = 25°C, Limited by Package

Continuous @ TA = 25°C, Limited by Wires

RqJC

PD

ID

2.6

58

62

50

32

°C/W

W

A

Thermal Resistance

Junction−to−Ambient (Note 1)

Total Power Dissipation @ TA = 25°C

Drain Current − Continuous @ TA = 25°C

RqJA

PD

ID

80

1.87

10.5

C/W

W

A

Thermal Resistance

Junction−to−Ambient (Note 2)

Total Power Dissipation @ TA = 25°C

Drain Current − Continuous @ TA = 25°C

RqJA

PD

ID

120

1.25

8.5

°C/W

W

A

Operating and Storage Temperature

TJ, and

Tstg

− 55 to

175

°C

Single Pulse Drain−to−Source Avalanche Energy

− Starting TJ = 25°C

(VDD = 50 Vdc, VGS = 10.0 Vdc,

IL = 11 Apk, L = 1.0 mH, RG = 25 W)

EAS

60

mJ

Maximum Lead Temperature for Soldering

Purposes, 1/8

″ from case for 10 seconds

TL

260

°C

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. When surface mounted to an FR4 board using 0.5 in sq drain pad size.

2. When surface mounted to an FR4 board using the minimum recommended

pad size.

MARKING DIAGRAM

& PIN ASSIGNMENTS

http://onsemi.com

Y

= Year

WW

= Work Week

60N02R = Device Code

24 V

8.4 m

W @ 10 V

RDS(on) TYP

62 A

ID MAX

V(BR)DSS

CASE 369D

DPAK

(Straight Lead)

STYLE 2

1

Gate

3

Source

2

Drain

4

Drain

1

Gate

3

Source

2

Drain

4

Drain

1

2

3

4

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

N−Channel

D

S

G

CASE 369AA

DPAK

(Surface Mount)

STYLE 2

1

2

3

4

1 2

3

4

CASE 369C

DPAK

(Surface Mount)

STYLE 2

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