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TPS79618KTTT Datasheet(PDF) 12 Page - Texas Instruments |
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TPS79618KTTT Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 18 page  www.ti.com RθJAmax + (125 * 55)°C 2.5 W + 28°C W (9) T J + T A ) P Dmax x R θJA (6) RθJA + T J–TA P Dmax (7) DDPAK Power Dissipation 15 20 25 30 35 40 0.1 1 10 100 Copper Heatsink Area − cm2 No Air Flow 150 LFM 250 LFM 1 oz. Copper Power Plane 1 oz. Copper Ground Plane 2 oz. Copper Solder Pad with 25 Thermal Vias Thermal Vias, 0.3 mm Diameter, 1,5 mm Pitch P Dmax + (5 * 2.5) V x 1 A + 2.5 W (8) TPS79601, TPS79618, TPS79625 TPS79628, TPS79630, TPS79633 SLVS351D – SEPTEMBER 2002 – REVISED OCTOBER 2004 Even if no external black body radiator type heatsink is attached to the package, the board on which the regulator is mounted provides some heatsinking From Figure 25, DDPAK Thermal Resistance vs through the pin solder connections. Some packages, Copper Heatsink Area, the ground plane needs to be like the DDPAK and SOT223 packages, use a copper 1 cm 2 for the part to dissipate 2.5 W. The operating plane underneath the package or the circuit board's environment used in the computer model to construct ground plane for additional heatsinking to improve Figure 25 consisted of a standard JEDEC High-K their thermal performance. Computer-aided thermal board (2S2P) with a 1 oz. internal copper plane and modeling can be used to compute very accurate ground plane. The package is soldered to a 2 oz. approximations of an integrated circuit's thermal per- copper pad. The pad is tied through thermal vias to formance in different operating environments (e.g., the 1 oz. ground plane. Figure 26 shows the side different types of circuit boards, different types and view of the operating environment used in the com- sizes of heatsinks, and different air flows, etc.). Using puter model. these models, the three thermal resistances can be combined into one thermal resistance between junc- tion and ambient (RΘJA). This RΘJA is valid only for the specific operating environment used in the computer model. Equation 5 simplifies into Equation 6: Rearranging Equation 6 gives Equation 7: Using Equation 6 and the computer model generated curves shown in Figure 25 and Figure 28, a designer can quickly compute the required heatsink thermal resistance/board area for a given ambient tempera- ture, power dissipation, and operating environment. The DDPAK package provides an effective means of Figure 25. DDPAK Thermal Resistance vs Copper Heatsink Area managing power dissipation in surface mount appli- cations. The DDPAK package dimensions are pro- vided in the Mechanical Data section at the end of the data sheet. The addition of a copper plane directly underneath the DDPAK package enhances the thermal performance of the package. To illustrate, the TPS72525 in a DDPAK package was chosen. For this example, the average input voltage is 5 V, the output voltage is 2.5 V, the average output current is 1 A, the ambient tempera- ture 55 °C, the air flow is 150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent current, the maximum aver- age power is calculated as Equation 8: Figure 26. DDPAK Thermal Resistance Substituting TJmax for TJ into Equation 6 gives From the data in Figure 27 and rearranging Equation 9: Equation 6, the maximum power dissipation for a different ground plane area and a specific ambient temperature can be computed. 12 |
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