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TPS54314 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS54314 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 10 page TPS54311, TPS54312 TPS54313, TPS54314 TPS54315, TPS54316 SLVS416A – FEBRUARY 2002 – JULY 2003 www.ti.com 2 Thesedevices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA OUTPUT VOLTAGE PACKAGED DEVICES PLASTIC HTSSOP (PWP)(1) TA OUTPUT VOLTAGE PACKAGED DEVICES PLASTIC HTSSOP (PWP)(1) 0.9 V TPS54311PWP 1.8 V TPS54314PWP –40 °C to 85°C 1.2 V TPS54312PWP –40 °C to 85°C 2.5 V TPS54315PWP –40 C to 85 C 1.5 V TPS54313PWP –40 C to 85 C 3.3 V TPS54316PWP (1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54316PWPR). See application section of data sheet for PowerPAD drawing and layout information. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) TPS54310 VIN, SS/ENA, SYNC –0.3 V to 7 V RT –0.3 V to 6 V Input voltage range, VI VSENSE –0.3 V to 4 V BOOT –0.3 V to 17 V VBIAS, PWRGD, COMP –0.3 V to 7 V Output voltage range, VO PH –0.6 V to 10 V PH InternallyLimited Source current, IO COMP, VBIAS 6 mA PH 6 A Sink current COMP 6 mA Sink current SS/ENA,PWRGD 10 mA Voltage differential AGND to PGND ±0.3 V Operating virtual junction temperature range, TJ –40 °C to 125°C Storage temperature, Tstg –65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Input voltage range, VI 3 6 V Operating junction temperature, TJ –40 125 °C PACKAGE DISSIPATION RATINGS(1) (2) PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT TA = 25°C POWER RATING TA = 70°C POWER RATING TA = 85°C POWER RATING 20-Pin PWP with solder 26.0 °C/W 3.85 W(3) 2.12 W 1.54 W 20-Pin PWP without solder 57.5 °C/W 1.73 W 0.96 W 0.69 W (1) For more information on the PWP package, refer to TI technical brief (SLMA002). (2) Test board conditions: 1. 3” × 3”, 2 layers, Thickness: 0.062” 2. 1.5 oz copper traces located on the top of the PCB 3. 1.5 oz copper ground plane on the bottom of the PCB 4. Ten thermal vias (see recommended land pattern in application section of this data sheet) (3) Maximum power dissipation may be limited by overcurrent protection. |
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