CAV24C32

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11

PACKAGE DIMENSIONS

WLCSP4, 0.76x0.76

CASE 567JY

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

−−−

MILLIMETERS

A1

D

0.76 BSC

E

b

0.15

0.16

e

0.40 BSC

0.35

D

E

A

B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

4X

b

12

B

A

0.05 C

A

A1

A2

C

0.0415

0.0715

0.76 BSC

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

A2

0.255 REF

PITCH

0.16

4X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.40

RECOMMENDED

A1

PACKAGE

OUTLINE

PITCH

DIE COAT

DETAIL A

(OPTIONAL)

A2

A3

A3

0.025 REF

DETAIL A