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STF60H150C Datasheet(PDF) 3 Page - Sangdest Microelectronic (Nanjing) Co., Ltd |
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STF60H150C Datasheet(HTML) 3 Page - Sangdest Microelectronic (Nanjing) Co., Ltd |
3 / 4 page Technical Data Green Products Data Sheet N1811, Rev. - • China - Germany - Korea - Singapore - United States • • http://www.smc-diodes.com - sales@ smc-diodes.com • STF60H150C Electrical Characteristics: Characteristics Symbol Condition Max. Units Forward Voltage Drop (per leg)* VF1 @ 30A, Pulse, TJ = 25 °C 0.95 V VF2 @ 30A, Pulse, TJ = 125 °C 0.85 V Reverse Current (per leg)* IR1 @VR = rated VR TJ = 25 °C 250 μA IR2 @VR = rated VR TJ = 125 °C 36 mA RSM Isolation Voltage(t = 1.0 second, R. H. < =30%, TA = 25 °C) VISO Clip mounting, the epoxy body away from the heatsink edge by more than 0.110" along the lead direction 4500 V Clip mounting, the epoxy body is inside the heatsink. 3500 Screw mounting, the epoxy body is inside the heatsink. 1500 * Pulse Width < 300µs, Duty Cycle <2% Thermal-Mechanical Specifications: Characteristics Symbol Condition Specification Units Junction Temperature TJ - -55 to +175 °C Storage Temperature Tstg - -55 to +175 °C Typical Thermal Resistance Junction to Case (per leg) RθJC DC operation 0.9 °C/W Approximate Weight wt - 2 g Case Style ITO-220AB |
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