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SD-2231 Datasheet(PDF) 3 Page - Copal Electronics

Part # SD-2231
Description  ROTARY CODED SWITCHES
Download  8 Pages
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Manufacturer  COPAL [Copal Electronics]
Direct Link  http://www.nidec-copal-electronics.com/e
Logo COPAL - Copal Electronics

SD-2231 Datasheet(HTML) 3 Page - Copal Electronics

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SD-1000 / 2000
ROTARY CODED SWITCHES
STANDARD SPECIFICATIONS
MECHANICAL CHARACTERISTICS
ENVIRONMENTAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Reflow profile for soldering heat evaluation
Reflow : two times maximum
Peak : 250
Over 230
Pre Heating Zone
180
(
℃)
250
200
150
100
50
150
90
± 30 s
30
± 10 s
Soldering Zone
Heating time
+5
0
Contact rating
Non-switching
Switching
Minimum
Contact resistance
Insulation resistance
Dielectric strength
DC50 V 100 mA
DC5 V 100 mA
DC20 mV 1 μA
1000 M
Ω (DC100 V) minimum
100 m
Ω maximum
AC250 V, 60 s
Circuit type
Operating temperature range
Storage temperature range
Sealing
Net weight
BCD (Real code, complementary code)
BCH (Real code, complementary code)
−40 ~ 85 °C
Non washable
Without knob Top setting 0.65 g
With knob Top setting 0.76 g
Without knob Side setting 0.95 g
With knob Side setting 1.05 g
Shock
Humidity
High temperature exposure
Low temperature exposure
Thermal shock
(Amplitude) 1.5 mm or
(Acceleration) 98 m/s
2,
10-500-10 Hz, 3 directions for 2 h each
490 m/s
2, 11 ms
6 directions for 3 times each
85 °C, 96 h
Resistance load DC50V 100mA
40 °C, Relative humidity 90 ~ 95 %, 240 h
−40 °C, 96 h
−40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles
Vibration
Load life
20000 steps
DC5 V, 100 mA
No. of positions
Adjustment torque
Stepping angle
Terminal strength (Through hole pin only)
Stop strength (With knob only)
Solderability
Soldering
heat
Shear (Gull wing only)
Substrate bending (Gull wing only)
Pull-off strength (Gull wing only)
16 (SD-1000), 10 (SD-2000)
4 ~ 25 mN·m {41 ~ 255 gf·cm}
22.5° (SD-1000), 36° (SD-2000)
10 N {1.02 kgf}, 10 s
245
± 3 °C, 2 ~ 3 s
5 N {0.51 kgf}, 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf}, 10 s
10 N {1.02 kgf} minimum
{ } : Reference only
Through
hole pin
Gull wing
Flow : 260
± 3 °C as the temperature in
a pot of molten solder, immersion
from head of terminal to backside
of board 5 ~ 6 s, two times
maximum
Manual soldering380
± 10 °C, 3 ~ 4 s
Reflow : Peak temperature 255 °C
(Please refer to the profile below.)
Manual soldering350
± 10 °C, 3 ~ 4 s


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