NLAS3799B, NLAS3799BL

http://onsemi.com

11

PACKAGE DIMENSIONS

WQFN16, 1.8x2.6, 0.4P

CASE 488AP−01

ISSUE B

A

b

A3

A1

0.08 C

SEATING

PLANE

NOTE 3

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND 0.30 MM

FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED PAD

AS WELL AS THE TERMINALS.

5. EXPOSED PADS CONNECTED TO DIE FLAG.

USED AS TEST CONTACTS.

DIM

MIN

MAX

MILLIMETERS

A

1.80 BSC

A1

0.40 BSC

A3

0.70

0.80

b

D

0.30

0.50

E

e

L

L1

0.20 REF

0.00

0.050

PIN 1 REFERENCE

D

A

E

B

0.15 C

2X

0.15 C

2X

0.10 C

C

L2

1

4

5

0.05 C

0.10 CA B

16 X

e

L

15 X

0.00

0.15

2.60 BSC

0.15

0.25

MOUNTING FOOTPRINT*

8

12

9

16

mm

inches

SCALE 20:1

1

0.400

0.0157

0.225

0.0089

0.463

0.0182

0.562

0.0221

2.900

0.1142

1.200

0.0472

2.100

0.0827

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

A1

A3

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L2

0.40

0.60

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.