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LM2587 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part No. LM2587
Description  SIMPLE SWITCHER 5A Flyback Regulator
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2587 Datasheet(HTML) 5 Page - National Semiconductor (TI)

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All Output Voltage Versions
Electrical Characteristics (Note 5) (Continued)
Symbol
Parameters
Conditions
Typical
Min
Max
Units
COMMON DEVICE PARAMETERS (Note 4)
θ
JA
Thermal Resistance
T Package, Junction to Ambient
(Note 10)
65
θ
JA
T Package, Junction to Ambient
(Note 11)
45
θ
JC
T Package, Junction to Case
2
θ
JA
S Package, Junction to Ambient
(Note 12)
56
˚C/W
θ
JA
S Package, Junction to Ambient
(Note 13)
35
θ
JA
S Package, Junction to Ambient
(Note 14)
26
θ
JC
S Package, Junction to Case
2
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to
be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see the Electrical
Characteristics.
Note 2: Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the LM2587 is used as
a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 5A. However, output current is internally limited when the
LM2587 is used as a flyback regulator (see the Application Hints section for more information).
Note 3: The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance (θJA), and the power
dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction temperature of the device: PD x θJA +TA(MAX) ≥ TJ-
(MAX)
. For a safe thermal design, check that the maximum power dissipated by the device is less than: PD ≤ [TJ(MAX) −TA(MAX))]/θJA. When calculating the maximum
allowable power dissipation, derate the maximum junction temperature — this ensures a margin of safety in the thermal design.
Note 4: External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the LM2587 is used as
shown in
Figure 2 and Figure 3, system performance will be as specified by the system parameters.
Note 5: All room temperature limits are 100% production tested, and all limits at temperature extremes are guaranteed via correlation using standard Statistical Qual-
ity Control (SQC) methods.
Note 6: A 1.0 M
Ω resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
Note 7: To measure this parameter, the feedback voltage is set to a low value, depending on the output version of the device, to force the error amplifier output high.
Adj: VFB = 1.05V; 3.3V: VFB = 2.81V; 5.0V: VFB = 4.25V; 12V: VFB = 10.20V.
Note 8: To measure this parameter, the feedback voltage is set to a high value, depending on the output version of the device, to force the error amplifier output low.
Adj: VFB = 1.41V; 3.3V: VFB = 3.80V; 5.0V: VFB = 5.75V; 12V: VFB = 13.80V.
Note 9: To measure the worst-case error amplifier output current, the LM2587 is tested with the feedback voltage set to its low value (specified in Note 7) and at its
high value (specified in Note 8).
Note 10: Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with 12 inch leads in a socket, or on a PC
board with minimum copper area.
Note 11: Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with 12 inch leads soldered to a PC board
containing approximately 4 square inches of (1oz.) copper area surrounding the leads.
Note 12: Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the
TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 13: Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area
of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 14: Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the
area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made
Simple® software.
www.national.com
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