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HDF942ES6 Datasheet(PDF) 5 Page - Shoulder Electronics Limited.

Part No. HDF942ES6
Description  This specification shall cover the characteristics of SAW filter With HDF942E used for the page
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Maker  SHOULDER [Shoulder Electronics Limited.]
Homepage  http://www.shoulder.cn/
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HDF942ES6 Datasheet(HTML) 5 Page - Shoulder Electronics Limited.

   
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SAW FILTER
HDF942E
SMD-6
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 5 of 8
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2-2.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2-2.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2-2.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2-2.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be solded. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.


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