Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

HDF911F11 Datasheet(PDF) 5 Page - Shoulder Electronics Limited.

Part No. HDF911F11
Description  Only leads of component may be soldered. Please avoid soldering another part of component
Download  5 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  SHOULDER [Shoulder Electronics Limited.]
Homepage  http://www.shoulder.cn/
Logo 

HDF911F11 Datasheet(HTML) 5 Page - Shoulder Electronics Limited.

   
Zoom Inzoom in Zoom Outzoom out
 5 / 5 page
background image
SAW FILTER
HDF911
F11
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 5 of 5
4. ENVIRONMENTAL CHARACTERISTICS
4-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 3.3.
4-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 3.3.
4-3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 3.3.
4-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 3.3.
4-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
3.3.
4-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 3.3.
4-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 3.3.
5. REMARK
5.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
5.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
5.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.


Html Pages

1  2  3  4  5 


Datasheet Download




Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn