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HDF869AN2S6 Datasheet(PDF) 5 Page - Shoulder Electronics Limited.

Part # HDF869AN2S6
Description  Tensile Strength of Carrier Tape: 4.4N/mm width
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Manufacturer  SHOULDER [Shoulder Electronics Limited.]
Direct Link  http://www.shoulder.cn/
Logo SHOULDER - Shoulder Electronics Limited.

HDF869AN2S6 Datasheet(HTML) 5 Page - Shoulder Electronics Limited.

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SAW FILTER
HDF869AN2-S6
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 5 of 8
3. Test Circuit
4. ENVIRONMENTAL CHARACTERISTICS
4-1 High temperature exposure(高温存放)
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
4-2 Low temperature exposure(低温存放)
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
4-3 Temperature cycling(温度循环)
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2-2.
4-4 Resistance to solder heat(耐焊接热)
1、immerge the solder bath at 260℃ for 10 sec.(浸入 260℃焊锡槽 10 秒)
2、the iron at 370℃ for 3 sec(烙铁 370℃3 秒)
4-5 Solderability(可焊性)
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2-2. (浸没在温度 245℃+5/-0℃的焊锡中,持续 3 秒,焊锡覆盖面积大于 95%)
4-6 Reflow soldering(回流焊)
The specimen shall be passed through the reflow furnace with the condition shown in
the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions for 1h, after which
the measurement shall be made. Test board shall be 1.6 mm thick. Base material shall be
glass fabric base epoxy resin.
4
-7 Mechanical shock(机械冲击)
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2-2.


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