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XMC4700-F144x1536 Datasheet(PDF) 29 Page - Infineon Technologies AG |
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XMC4700-F144x1536 Datasheet(HTML) 29 Page - Infineon Technologies AG |
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29 / 130 page  XMC4700 / XMC4800 XMC4000 Family General Device Information Preliminary Data Sheet 29 V0.7, 2015-10 VSS C12 - - Power VSS P12 - - Power VSS P14 - - Power VSSO L12 89 63 Power VSS - Exp. Pad Exp. Pad Power Exposed Die Pad The exposed die pad is connected internally to VSS. For proper operation, it is mandatory to connect the exposed pad directly to the common ground on the board. For thermal aspects, please refer to the Data Sheet. Board layout examples are given in an application note. n.c. A13 - - - n.c. B1 - - - n.c. B10 - - - n.c. B12 - - - n.c. B14 - - - n.c. C13 - - - n.c. C14 - - - n.c. E13 - - - n.c. H13 - - - n.c. J13 - - - n.c. K13 - - - n.c. P13 - - - Table 10 Package Pin Mapping (cont’d) Function LFBGA-196 LQFP-144 LQFP-100 Pad Type Notes Subject to Agreement on the Use of Product Information |
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