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TLV172 Datasheet(PDF) 8 Page - Texas Instruments |
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TLV172 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 42 page 8 TLV172, TLV2172, TLV4172 SBOS784 – NOVEMBER 2016 www.ti.com Product Folder Links: TLV172 TLV2172 TLV4172 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: TLV172 THERMAL METRIC(1) TLV172 UNIT D (SOIC) DBV (SOT-23) DCK (SC70) 8 PINS 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 126.5 227.9 285.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 80.6 115.7 60.5 °C/W RθJB Junction-to-board thermal resistance 67.1 65.9 78.9 °C/W ψJT Junction-to-top characterization parameter 31.0 10.7 0.8 °C/W ψJB Junction-to-board characterization parameter 65.6 65.3 77.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information: TLV2172 THERMAL METRIC(1) TLV2172 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 116.1 158 °C/W RθJC(top) Junction-to-case (top) thermal resistance 69.8 48.6 °C/W RθJB Junction-to-board thermal resistance 56.6 78.7 °C/W ψJT Junction-to-top characterization parameter 22.5 3.9 °C/W ψJB Junction-to-board characterization parameter 56.1 77.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.6 Thermal Information: TLV4172 THERMAL METRIC(1) TLV4172 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 82.7 111.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.3 40.8 °C/W RθJB Junction-to-board thermal resistance 37.3 54.1 °C/W ψJT Junction-to-top characterization parameter 8.9 3.8 °C/W ψJB Junction-to-board characterization parameter 37 53.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
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