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NCV7705DQR2G Datasheet(PDF) 5 Page - ON Semiconductor |
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NCV7705DQR2G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 38 page NCV7705, NCV7706 www.onsemi.com 5 ABSOLUTE MAXIMUM RATINGS Symbol Rating Min Max Unit Vs Power supply voltage − Continuous supply voltage − Transient supply voltage (t < 500 ms, ”clamped load dump”) −0.3 −0.3 28 40 V VCC Logic supply −0.3 5.5 V Vdig DC voltage at all logic pins (SO, SI, SCLK, CSB, PWM1) −0.3 VCC + 0.3 V Visout/pwm2 Current monitor output / PWM2 logic input −0.3 VCC + 0.3 V Vchp Charge pump output (the most stringent value is applied) −25 Vs − 25 40 Vs + 15 V Voutx, Vecon, Vecfb Static output voltage (OUT1−9, ECON, ECFB) −0.3 Vs + 0.3 V Iout1/4 OUT1/4 Output current − TJ > 25°C − TJ < 25°C −5 −5.5 5 5.5 A Iout2/3 OUT2/3 Output current − TJ > 25°C − TJ < 25°C −1.25 −1.35 1.35 1.35 A Iout5 OUT5 Output current − DC − Transient −5 5 A Iout6 OUT6 Output current − DC − Transient −2.5 2.5 A Iout7/8 OUT7/8 Output current − DC − Transient −1.25 1.25 A Iout9 OUT9 Output current − DC − Transient −10 10 A Iout_ecfb (NCV7706 only) ECFB Output current 1.25 A ESD_HBM ESD Voltage, Human Body Model (HBM); (100 pF, 1500 W) (Note 1) − All pins − Output pins OUT1−4 and ECFB to GND (all unzapped pins grounded) −2 −4 2 4 kV ESD_CDM ESD according to CDM (Charge Device Model) (Note 1) − All pins − Corner pins −500 −750 500 750 V TJ Operating junction temperature range −40 150 °C Tstg Storage temperature range −55 150 °C MSL Moisture sensitivity level (Note 2) MSL3 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Charge Device Model tested per EIA/JES D22/C101, Field Induced Charge Model 2. For soldering information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS Symbol Rating Value Unit RθJA Thermal Characteristics, SSOP36−EP, 1−layer PCB Thermal Resistance, Junction−to−Air (Note 3) 49.4 °C/W RθJA Thermal Characteristics, SSOP36−EP, 4−layer PCB Thermal Resistance, Junction−to−Air (Note 4) 24 °C/W 3. Values based on PCB of 76.2 x 114.3 mm, 72 μm copper thickness, 20% copper area coverage and FR4 PCB substrate. 4. Values based on PCB of 76.2 x 114.3 mm, 72 / 36 μm copper thickness (signal layers / internal planes), 20 / 90% copper area coverage (signal layers / internal planes) and FR4 PCB substrate. |
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