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NCV7705DQR2G Datasheet(PDF) 5 Page - ON Semiconductor

Part # NCV7705DQR2G
Description  Mirror-Module Driver-IC
Download  38 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV7705DQR2G Datasheet(HTML) 5 Page - ON Semiconductor

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NCV7705, NCV7706
www.onsemi.com
5
ABSOLUTE MAXIMUM RATINGS
Symbol
Rating
Min
Max
Unit
Vs
Power supply voltage
− Continuous supply voltage
− Transient supply voltage (t < 500 ms, ”clamped load dump”)
−0.3
−0.3
28
40
V
VCC
Logic supply
−0.3
5.5
V
Vdig
DC voltage at all logic pins (SO, SI, SCLK, CSB, PWM1)
−0.3
VCC + 0.3
V
Visout/pwm2
Current monitor output / PWM2 logic input
−0.3
VCC + 0.3
V
Vchp
Charge pump output (the most stringent value is applied)
−25
Vs − 25
40
Vs + 15
V
Voutx,
Vecon, Vecfb
Static output voltage (OUT1−9, ECON, ECFB)
−0.3
Vs + 0.3
V
Iout1/4
OUT1/4 Output current
− TJ > 25°C
− TJ < 25°C
−5
−5.5
5
5.5
A
Iout2/3
OUT2/3 Output current
− TJ > 25°C
− TJ < 25°C
−1.25
−1.35
1.35
1.35
A
Iout5
OUT5 Output current
− DC
− Transient
−5
5
A
Iout6
OUT6 Output current
− DC
− Transient
−2.5
2.5
A
Iout7/8
OUT7/8 Output current
− DC
− Transient
−1.25
1.25
A
Iout9
OUT9 Output current
− DC
− Transient
−10
10
A
Iout_ecfb
(NCV7706
only)
ECFB Output current
1.25
A
ESD_HBM
ESD Voltage, Human Body Model (HBM); (100 pF, 1500
W) (Note 1)
− All pins
− Output pins OUT1−4 and ECFB to GND (all unzapped pins grounded)
−2
−4
2
4
kV
ESD_CDM
ESD according to CDM (Charge Device Model) (Note 1)
− All pins
− Corner pins
−500
−750
500
750
V
TJ
Operating junction temperature range
−40
150
°C
Tstg
Storage temperature range
−55
150
°C
MSL
Moisture sensitivity level (Note 2)
MSL3
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Charge Device Model tested per EIA/JES D22/C101, Field Induced Charge Model
2. For soldering information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Symbol
Rating
Value
Unit
RθJA
Thermal Characteristics, SSOP36−EP, 1−layer PCB
Thermal Resistance, Junction−to−Air (Note 3)
49.4
°C/W
RθJA
Thermal Characteristics, SSOP36−EP, 4−layer PCB
Thermal Resistance, Junction−to−Air (Note 4)
24
°C/W
3. Values based on PCB of 76.2 x 114.3 mm, 72
μm copper thickness, 20% copper area coverage and FR4 PCB substrate.
4. Values based on PCB of 76.2 x 114.3 mm, 72 / 36
μm copper thickness (signal layers / internal planes), 20 / 90% copper area coverage (signal
layers / internal planes) and FR4 PCB substrate.


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