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CY7C1041BV33-17ZI Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1041BV33-17ZI
Description  256K x 16 Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1041BV33-17ZI Datasheet(HTML) 1 Page - Cypress Semiconductor

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256K x 16 Static RAM
CY7C1041BV33
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
Document #: 38-05168 Rev. **
Revised November 15, 2001
041BV33
Features
• High speed
—tAA = 12 ns
• Low active power
— 612 mW (max.)
• Low CMOS standby power (Commercial L version)
— 1.8 mW (max.)
• 2.0V Data Retention (600
µW at 2.0V retention)
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE and OE features
Functional Description
The CY7C1041BV33 is a high-performance CMOS Static
RAM organized as 262,144 words by 16 bits.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0
through A17). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8 through I/O15) is written into the location
specified on the address pins (A0 through A17).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8 to I/O15. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O0 through I/O15) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1041BV33 is available in a standard 44-pin
400-mil-wide body width SOJ and 44-pin TSOP II package
with center power and ground (revolutionary) pinout.
Logic Block Diagram
Pin Configuration
A1
A2
A3
A4
A5
A6
A7
A8
COLUMN
DECODER
INPUT BUFFER
256K x 16
ARRAY
A0
1024 x 4096
I/O0 – I/O7
OE
I/O8 – I/O15
CE
WE
BLE
BHE
Top View
SOJ
TSOP II
WE
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
12
13
41
44
43
42
16
15
29
30
VCC
A5
A6
A7
A8
A0
A1
OE
VSS
A17
I/O15
A2
CE
I/O2
I/O0
I/O1
BHE
A3
A4
18
17
20
19
I/O3
27
28
25
26
22
21
23
24
VSS
I/O6
I/O4
I/O5
I/O7
A16
A15
BLE
VCC
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
I/O8
A14
A13
A12
A11
A9
A10
NC
Selection Guide
-12
-15
-17
-20
-25
Maximum Access Time (ns)
12
15
17
20
25
Maximum Operating Current (mA) Comm’l
190
170
160
150
130
Ind’l
-190
180
170
150
Maximum CMOS Standby
Current (mA)
Com’l/Ind’l
888
8
8
Com’l
L
0.5
0.5
0.5
0.5
0.5


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