NB100ELT23L

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3

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

Power Supply

GND = 0 V

3.8

V

Input Voltage

GND = 0 V

3.8

V

Output Current

Continuous

Surge

50

100

mA

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

SO−8

SO−8

190

130

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

SO−8

41 to 44

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

TSSOP−8

TSSOP−8

185

140

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

TSSOP−8

41 to 44

°C/W

Wave Solder

Pb−Free

<2 to 3 sec @ 260

°C

265

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

Symbol

Characteristic

−40

°C

25

°C

85

°C

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Power Supply Current (Outputs set to HIGH)

10

23

30

10

23

30

10

24

30

mA

Power Supply Current (Outputs set to LOW)

15

26

35

15

26

35

15

27

35

mA

Input HIGH Voltage

2075

2420

2075

2420

2075

2420

mV

Input LOW Voltage

1355

1675

1355

1675

1355

1675

mV

Input HIGH Voltage Common Mode Range

(Note 3)

1.2

3.3

1.2

3.3

1.2

3.3

V

Input HIGH Current

150

150

150

mA

Input LOW Current

−150

−150

−150

mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm.

differential input signal.