NB3V60113GV3

www.onsemi.com

7

PACKAGE DIMENSIONS

C

A

SEATING

PLANE

D

E

0.10 C

A3

A

A1

0.10 C

WDFN8 2x2, 0.5P

CASE 511AT

ISSUE O

DIM

A

MIN

MAX

MILLIMETERS

0.70

0.80

A1

0.00

0.05

A3

0.20 REF

b

0.20

0.30

D

E

e

L

PIN ONE

REFERENCE

0.05 C

0.05 C

A

0.10 C

NOTE 3

L2

e

b

B

4

8

8X

1

5

0.05 C

L1

2.00 BSC

2.00 BSC

0.50 BSC

0.40

0.60

---

0.15

BOTTOM VIEW

L

7X

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L2

0.50

0.70

B

TOP VIEW

SIDE VIEW

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL TIP.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.30

0.50

0.78

7X

DIMENSIONS: MILLIMETERS

0.30

PITCH

8X

1

PACKAGE

OUTLINE

RECOMMENDED

0.88

2X

2X

8X

e/2

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