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BQ57120EZB38 Datasheet(PDF) 11 Page - SynQor Worldwide Headquarters
SYNQOR [SynQor Worldwide Headquarters]
BQ57120EZB38 Datasheet(HTML) 11 Page - SynQor Worldwide Headquarters
/ 13 page
Product # BQ57120EZB38
Doc.# 005-0006442 Rev. D
Figure E: Power Up/Down Diagram (not to scale) showing Start-Up Inhibit Period
Start-Up Inhibit Period: Figure E details the Start-Up Inhibit Period
for the BusQor module. At time t0, when Vin is applied with On/Off pin
asserted (enabled), the BusQor output begins to build up. Before time t1,
when the input voltage is below the UVL threshold, the unit is disabled
by the Input Under-Voltage Lockout feature. When the input voltage rises
above the UVL threshold, the Input Under-Voltage Lockout is released, and
a typical Startup Inhibit Period of 12ms is initiated. The output builds up to
90% of the nominal value of 12V in a period of 15ms typical (50 % load).
At time t2, when the On/Off pin is de-asserted (disabled), the BusQor
output instantly drops to 0V. Fall time from 12V to 0V is dependent on
output capacitance and any parasitic trace inductance in the output load
At time t3, when the On/Off pin is re-asserted (enabled), the BusQor
module output begins to build up after the inhibit period of 200 ms typical
Refer to the Control Features section of the data sheet for details on
enabling and disabling methods for Bus Qor modules.
Component Keep Out Area: Keep out areas for components not
referenced to the Primary circuit are shown in shaded areas in Figure F.
The keep out areas shown are consistent with UL’s requirements for Basic
Insulation of 0.04” (40 mils) for Pollution degree 2. User should consult UL
standards for other insulation classes and operating environments.
For applications that require mounting parts BELOW the BusQor
module, one should be aware of potential high levels of electromagnetic
interference, in addition to safety keep out. Users are advised to consult
SynQor Applications engineering in such applications.
Copper Keep Out Area: Keep out areas shown in Figure F are to be
observed for Top layer copper traces and vias. Internal layers buried one
or more layers may be exempt, depending on the PCB material grade and
thickness. Users are advised to consult UL standards for details.
All layers including top and bottom, are subject to the keep out areas
shown around Primary pins of BusQor module. Actual keep outs along the
surface (Creepage) may vary depending on the PCB material CTI. Users
are advised to consult UL standards for details.
Bridging Components: Bridging components like EMI filter capacitors
required to be placed as close as possible to the BusQor module for
optimum performance must observe the clearance/creepage requirements
of 0.04”(40 mils) between pads to maintain compliance to UL standards for
the overall power system.
Note: Referenced keep out widths are adequate to withstand UL’s Basic
Insulation Dielectric strength tests for approved PCB materials. Applications
requiring Double or Reinforced insulation must double the keep out widths
shown in Figure F. Keep out areas shown have standard margins above
UL’s minimum requirements.
Figure F: Keep Out Areas for BusQor module (bottom view)
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