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PS40U120CT Datasheet(PDF) 1 Page - Chongqing Pingwei Enterprise co.,Ltd |
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PS40U120CT Datasheet(HTML) 1 Page - Chongqing Pingwei Enterprise co.,Ltd |
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1 / 1 page - 页码 - Rev. 14-1 http:// www.perfectway.cn PS40U120(F,B,H)CT thru PS40U150(F,B,H)CT 40A Schottky Barrier Rectifier FEATURE High current capability Ultra low forward voltage drop Low power loss, high efficiency High surge capability High ESD capability High temperature soldering guaranteed: 260°C/10s/0.25"(6.35mm) from case MECHANICAL DATA Case: Molded with UL-94 Class V-0 recognized Flame Retardant Epoxy Mounting position: any TYPICAL APPLICATIONS For use in low voltage, high frequency rectifier of switching mode power supplies, freewheeling diodes, DC/DC converters and polarity protection application. TO-220AB ITO-220AB PS40UXXCT PS40UXXFCT TO-263 TO-262 PS40UXXBCT PS40UXXHCT Ratings at 25°C ambient temperature unless otherwise specified, Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. MAXIMUM RATINGS Parameter Symbol PS40U120CT PS40U150CT units Maximum Recurrent Peak Reverse Voltage VRRM 120 150 V Maximum RMS Voltage VRMS 84 105 V Maximum DC Blocking Voltage VDC 120 150 V Maximum Average Forward Rectified Current at TC=90°C total device IF(AV) 40.0 A per diode 20.0 Peak Forward Surge Current 8.3ms Single Half sine-wave superimposed on rate load per diode (JEDEC method) IFSM 200 A Junction Capacitance (Note1) CJ 1100 pF Storage Temperature Range TSTG -55 to +150 °C Operation Temperature Range TJ -55 to +150 °C ELECTRONICAL CHARACTERISTICS Parameter Symbol PS40U120CT PS40U150CT units Maximum Forward Voltage Drop per diode at 20A (Note 2) VF 0.86 0.90 V Maximum DC Reverse Current at rated DC blocking voltage (Note 2) @ TC =25°C IR 0.1 mA @ TC=100°C 30.0 THERMAL CHARACTERISTICS Parameter Symbol ITO-220 TO-220 TO-262 TO-263 units Typical Thermal Resistance (Note 3) Rth (JC) 2.8 1.8 1.8 °C/W Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc. 2. Pulse test: 300 μs pulse width, 1% duty cycle. 3. Thermal Resistance from Junction to Case Mounted on heatsink. |
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