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TZA1045 Datasheet(PDF) 2 Page - NXP Semiconductors

Part No. TZA1045
Description  Photodiode and amplifier IC for CD and DVD applications
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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 2 page
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2003 Jun 26
2
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for
CD and DVD applications
TZA1045
FEATURES
• High frequency RF amplifiers
(typical bandwidth = 240 MHz)
• Suitable for all CD (785 nm) and DVD (655 nm)
read/write applications
• Four high bandwidth central outputs (A, B, C, and D),
four satellite outputs (E, F, G, and H) and one high
bandwidth differential output (RFP, RFN)
• Internal current clamp and current fold back (power
reduction)
• Versatile programmable gain switches (CD/DVD, H/L,
and R/W)
• Single 5 V supply
• Current outputs for optimum signal transport over flex
cable
• Small outline package SSOP16T with good positional
tolerance.
APPLICATIONS
• CD and DVD read/write applications.
GENERAL DESCRIPTION
The TZA1045 is a single optical pick-up IC for read/write
systems and is suitable for CD and DVD applications.
The device contains eight RF amplifiers for the central and
satellite diodes and one differential RF amplifier (RFP
and RFN) which handles the sum of the four A, B, C, and D
central diode signals.
Programming the gain is a very versatile way to optimize
interfacing between the TZA1045 and the pre-amplifier.
The gain can be programmed for CD or DVD media with
the gain switch CD/DVD.
The H/L switch can be used for CD-R or CD-RW discs.
Gain switch R/W is used to reduce the gain during writing.
During writing, the high peak signals for the central and
satellite segments are clamped internally and the output
currents of the A, B, C, D, E, F, G, and H segments are
reduced to almost zero (fold back) to minimize the power
consumption.
All outputs are current outputs that can supply a maximum
of 8 mA. In CD-R writing mode, the clipping level of the
output currents is between 5 and 8 mA.
The SSOP16T package has a low spread on the
z tolerance. The z tolerance is measured between the
diodes (chip surface) and the bottom of the leads. The
diodes have an offset of 54
µm in the ‘y’ direction with
respect to the leadframe centre and a tolerance of
±50 µm
in both ‘x’ and ‘y’ directions.
The diodes are placed under an angle of 45
°±1° with
respect to the leadframe of the module.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TZA1045TS
SSOP16T
plastic shrink small outline package/transparent;
16 leads (straight); body width 4.4 mm
SOT734-1




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