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DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1OE

1A

2Y

GND

2OE

1Y

2A

4

3

2

1

5

6

7

8

GND

2Y

1A

1OE

2A

1Y

2OE

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G125

DUAL BUS BUFFER GATE

WITH 3-STATE OUTPUTS

SCES204K – APRIL 1999 – REVISED JUNE 2005

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

•

Inputs Accept Voltages to 5.5 V

•

•

Low Power Consumption, 10-

µA Max I

CC

•

±24-mA Output Drive at 3.3 V

•

•

•

Operation

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is

high.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74LVC2G125YEAR

0.17-mm Small Bump – YEA

NanoFree™ – WCSP (DSBGA)

SN74LVC2G125YZAR

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

_ _ _CM_

NanoStar™ – WCSP (DSBGA)

SN74LVC2G125YEPR

0.23-mm Large Bump – YEP

–40°C to 85°C

NanoFree™ – WCSP (DSBGA)

SN74LVC2G125YZPR

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC2G125DCTR

C25_ _ _

Reel of 3000

SN74LVC2G125DCUR

VSSOP – DCU

C25_

Reel of 250

SN74LVC2G125DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.