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ML7029 Datasheet(PDF) 27 Page - LAPIS Semiconductor Co., Ltd. |
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ML7029 Datasheet(HTML) 27 Page - LAPIS Semiconductor Co., Ltd. |
27 / 29 page FEDL7029-04 ML7029 27/29 PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SSOP30-P-56-0.65-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating ( ≥5μm) Package weight (g) 0.19 TYP. 5 Rev. No./Last Revised 5/Dec. 5, 1996 (Unit: mm) |
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