RECOMMENDED OPERATING CONDITIONS

PACKAGE DISSIPATION RATINGS

(1) (2)

ELECTRICAL CHARACTERISTICS

TPS54310-EP

MIN

MAX

UNIT

Input voltage

3

6

V

Operating virtual-junction temperature

–55

125

°C

THERMAL IMPEDANCE

PACKAGE

JUNCTION-TO-AMBIENT

POWER RATING

POWER RATING

POWER RATING

20-Pin PWP with solder

26

°C/W

2.12 W

1.54 W

20-Pin PWP without solder

57.5

°C/W

1.73 W

0.96 W

0.69 W

(1)

For more information on the PWP package, refer to TI technical brief, literature number SLMA002.

(2)

Test board conditions:

a. 3 inch

× 3 inch, 2 layers, Thickness: 0.062 inch

b. 1.5 oz copper traces located on the top of the PCB

c. 1.5 oz copper ground plane on the bottom of the PCB

d. Ten thermal vias (see recommended land pattern in application section of this data sheet)

(3)

Maximum power dissipation may be limited by overcurrent protection.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY VOLTAGE, VIN

VIN input voltage range

3

6

V

6.2

9.6

Quiescent current

8.4

12.8

mA

Shutdown, SS/ENA = 0 V

1

1.4

UNDERVOLTAGE LOCKOUT

Start threshold voltage, UVLO

2.95

3

V

Stop threshold voltage, UVLO

2.70

2.80

Hysteresis voltage, UVLO

0.10

0.16

V

2.5

µs

BIAS VOLTAGE

Output voltage, VBIAS

2.70

2.80

2.95

V

100

µA

CUMULATIVE REFERENCE

Accuracy

0.880

0.891

0.900

V

REGULATION

0.07

%/V

0.07

0.03

%/A

0.03

(1)

Specified by design

(2)

Static resistive loads only

(3)

Specified by the circuit used in Figure 10.

Copyright © 2008, Texas Instruments Incorporated

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Product Folder Link(s): TPS54310-EP