TLV5638EP

2.7V TO 5.5V LOW POWER DUAL 12BIT DIGITALTOANALOG

CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

SGLS130B − JULY 2002 − REVISED DECEMBER 2003

1

POST OFFICE BOX 655303

features

− One Assembly/Test Site, One Fabrication

Site

−55

°C to 125°C

Sources (DMS) Support

1

µs in Fast Mode,

3.5

µs in Slow Mode

† Component qualification in accordance with JEDEC and industry

standards to ensure reliable operation over an extended

temperature range. This includes, but is not limited to, Highly

Accelerated Stress Test (HAST) or biased 85/85, temperature

cycle, autoclave or unbiased HAST, electromigration, bond

intermetallic life, and mold compound life. Such qualification

testing should not be viewed as justifying use of this component

beyond specified performance and environmental limits.

Ports

applications

description

The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows

glueless interface to TMS320 and SPI

, QSPI, and Microwire serial ports. It is programmed with a 16-bit

serial string containing 4 control and 12 data bits.

The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class

AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows

the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage

reference, the TLV5638 simplifies overall system design.

Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented

with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in

an 8-pin SOIC package to reduce board space.

ORDERING INFORMATION

TA

PACKAGE‡

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

−40

°C to 125°C

SOIC − D

Tape and reel

TLV5638QDREP

5638QE

−55

°C to 125°C

SOIC − D

Tape and reel

TLV5638MDREP

5638ME

‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines

are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright

 2002 − 2003, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

SPI and QSPI are trademarks of Motorola, Inc.

Microwire is a trademark of National Semiconductor Corporation.

1

2

3

4

8

7

6

5

DIN

SCLK

CS

OUTA

OUTB

REF

AGND

D PACKAGE

(TOP VIEW)