1

FEATURES

Seemechanicaldrawingsfordimensions.

DCKPACKAGE

(TOP VIEW)

3

4

2A

2

GND

2Y

5

1

1A

V

CC

6

1Y

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G07-EP

DUAL BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

• Controlled Baseline

• Inputs and Open-Drain Outputs Accept

Voltages up to 5.5 V

–

One Assembly Site

• Max t

–

One Test Site

• Low Power Consumption, 10 µA Max I

CC

–

One Fabrication Site

• ±24-mA Output Drive at 3.3 V

• Extended Temperature Performance of –55°C

to 125

°C

• Typical V

• Enhanced Diminishing Manufacturing Sources

(DMS) Support

• Typical V

• Enhanced Product-Change Notification

• I

Operation

• Supports 5-V V

• Latch-Up Performance Exceeds 100 mA Per

(1)

Component qualification in accordance with JEDEC and

JESD 78, Class II

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

• ESD Protection Exceeds JESD 22

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

–

2000-V Human-Body Model (A114-A)

electromigration, bond intermetallic life, and mold compound

–

200-V Machine Model (A115-A)

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

–

1000-V Charged-Device Model (C101)

performance and environmental limits.

drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired

AND functions. The maximum sink current is 32 mA.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–55

°C to 125°C SOT (SC-70) – DCK

Reel of 250

SN74LVC2G07MDCKTEP

CHC

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.