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SN74LVC2G07-EP Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G07-EP Datasheet(HTML) 1 Page - Texas Instruments |
1 / 11 page 1 FEATURES Seemechanicaldrawingsfordimensions. DCKPACKAGE (TOP VIEW) 3 4 2A 2 GND 2Y 5 1 1A V CC 6 1Y DESCRIPTION/ORDERING INFORMATION SN74LVC2G07-EP www.ti.com ....................................................................................................................................................................................................... SCES719 – MAY 2008 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS • Controlled Baseline • Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V – One Assembly Site • Max t pd of 5.7 ns at 3.3 V – One Test Site • Low Power Consumption, 10 µA Max I CC – One Fabrication Site • ±24-mA Output Drive at 3.3 V • Extended Temperature Performance of –55°C to 125 °C • Typical V OLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Enhanced Diminishing Manufacturing Sources (DMS) Support • Typical V OHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C • Enhanced Product-Change Notification • I off Supports Partial-Power-Down Mode • Qualification Pedigree (1) Operation • Supports 5-V V CC Operation • Latch-Up Performance Exceeds 100 mA Per (1) Component qualification in accordance with JEDEC and JESD 78, Class II industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited • ESD Protection Exceeds JESD 22 to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, – 2000-V Human-Body Model (A114-A) electromigration, bond intermetallic life, and mold compound – 200-V Machine Model (A115-A) life. Such qualification testing should not be viewed as justifying use of this component beyond specified – 1000-V Charged-Device Model (C101) performance and environmental limits. This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired AND functions. The maximum sink current is 32 mA. This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING –55 °C to 125°C SOT (SC-70) – DCK Reel of 250 SN74LVC2G07MDCKTEP CHC (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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