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OMAP3503-HIREL Datasheet(PDF) 7 Page - Texas Instruments |
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OMAP3503-HIREL Datasheet(HTML) 7 Page - Texas Instruments |
7 / 329 page OMAP3503-HiRel www.ti.com SPRS663 – FEBRUARY 2010 1 OMAP3503-HiRel Applications Processor ......... 1 4.3 DPLL and DLL Specifications ..................... 209 5 VIDEO DAC SPECIFICATIONS .................... 215 1.1 Features .............................................. 1 5.1 Interface Description .............................. 215 1.2 Description ........................................... 3 5.2 Electrical Specifications Over Recommended 1.3 Functional Block Diagram ............................ 6 Operating Conditions .............................. 217 2 TERMINAL DESCRIPTION ............................. 8 5.3 Analog Supply (vdda_dac) Noise Requirements 2.1 Terminal Assignment ................................ 8 ..................................................... 219 2.2 Pin Assignments .................................... 12 5.4 External Component Value Choice ............... 220 2.3 Ball Characteristics ................................. 25 6 TIMING REQUIREMENTS AND SWITCHING CHARACTERISTICS ................................. 221 2.4 Multiplexing Characteristics ....................... 145 2.5 Signal Description ................................. 161 6.1 Timing Test Conditions ............................ 221 3 ELECTRICAL CHARACTERISTICS ............... 186 6.2 Interface Clock Specifications ..................... 221 3.1 Power Domains ................................... 186 6.3 Timing Parameters ................................ 222 6.4 External Memory Interfaces ....................... 223 3.2 Absolute Maximum Ratings ....................... 188 6.5 Video Interfaces ................................... 252 3.3 Recommended Operating Conditions ............. 190 6.6 Serial Communications Interfaces ................ 269 3.4 DC Electrical Characteristics ...................... 192 6.7 Removable Media Interfaces ...................... 302 3.5 Core Voltage Decoupling .......................... 195 6.8 Test Interfaces .................................... 317 3.6 Power-up and Power-down ....................... 197 7 PACKAGE CHARACTERISTICS ................... 323 4 CLOCK SPECIFICATIONS .......................... 201 7.1 Package Thermal Resistance ..................... 323 4.1 Input Clock Specifications ......................... 202 7.2 Device Support .................................... 323 4.2 Output Clock Specifications ....................... 207 Copyright © 2010, Texas Instruments Incorporated Contents 7 Submit Documentation Feedback Product Folder Link(s): OMAP3503-HiRel |
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