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CC2564CRVMT Datasheet(PDF) 1 Page - Texas Instruments |
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CC2564CRVMT Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 52 page  Product Folder Sample & Buy Technical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2564C SWRS199A – APRIL 2016 – REVISED NOVEMBER 2016 CC2564C Dual-Mode Bluetooth® Controller 1 Device Overview 1 1.1 Features 1 • TI's Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support • Bluetooth 4.2 Component Qualified (Declaration ID: D032801); Compliant up to the HCI Layer • Highly Optimized for Size-Constrained and Low- Cost Designs: – Single-Ended 50-Ω RF Interface – Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm (VQFNP-MR) • BR and EDR Features Include: – Up to Seven Active Devices – Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves – Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet – Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded) – Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power – Support of Multiple Bluetooth Profiles With Enhanced QoS • Low Energy Features Include: – Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption – Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance – Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy – Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central – Network Support for up to 10 Devices – Time Line Optimization Algorithms to Achieve Maximum Channel Utliization • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking) – Class 1 TX Power up to +12 dBm – Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required – Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time – Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions • Advanced Power Management for Extended Battery Life and Ease of Design – On-Chip Power Management, Including Direct Connection to Battery – Low Power Consumption for Active, Standby, and Scan Bluetooth Modes – Shutdown and Sleep Modes to Minimize Power Consumption • Physical Interfaces: – UART Interface With Support for Maximum Bluetooth Data Rates • UART Transport Layer (H4) With Maximum Rate of 4 Mbps • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps – Fully Programmable Digital Pulse-Code Modulation (PCM)–Inter-IC Sound (I2S) Codec Interface • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack 1.2 Applications • Wireless Audio Solutions • mPOS • Medical Devices • Set-Top Boxes (STBs) • Wearable Devices • Sensor Hub, Sensor Gateway – Home and Factory Automation |
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