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DSC2311KL2-R0002 Datasheet(PDF) 8 Page - Microchip Technology |
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DSC2311KL2-R0002 Datasheet(HTML) 8 Page - Microchip Technology |
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8 / 18 page  DSC2311 DS20005611A-page 8 2016 Microchip Technology Inc. 5.0 SOLDER REFLOW PROFILE 260°C 217°C 200°C 150°C 25°C 8 MINUTES MAX. PRE-HEAT REFLOW COOL TIME 60-180 SECONDS 60-150 SECONDS 20-40 SECONDS 6-PIN QFN MSL 1 @ 260°C refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max. Preheat Time 150°C to 200°C 60-180 sec. Time Maintained above 217°C 60-150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20-40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max. |
Similar Part No. - DSC2311KL2-R0002 |
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