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DSC2311KI1-R0001 Datasheet(PDF) 11 Page - Microchip Technology |
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DSC2311KI1-R0001 Datasheet(HTML) 11 Page - Microchip Technology |
11 / 18 page 2016 Microchip Technology Inc. DS20005611A-page 11 DSC2311 RECOMMENDED LAND PATTERN Dimension Limits Units C Contact Pad Width (X4) Contact Pad Spacing Contact Pad Width (X2) Contact Pitch X2 X1 0.25 0.65 MILLIMETERS 0.825 BSC MIN E MAX 1.45 Space Between Contacts (X3) Space Between Contacts (X4) G2 G1 0.60 0.38 Microchip Technology Drawing C04-3005A NOM 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] 1 2 6 Y Contact Pad Length (X6) 0.85 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C E X1 X2 Y G1 G2 SILK SCREEN |
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