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ITS4300S-SJ-D Datasheet(PDF) 6 Page - Infineon Technologies AG

Part No. ITS4300S-SJ-D
Description  Smart High-Side NMOS-Power Switch
Download  22 Pages
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Maker  INFINEON [Infineon Technologies AG]
Homepage  http://www.infineon.com
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ITS4300S-SJ-D Datasheet(HTML) 6 Page - Infineon Technologies AG

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Data Sheet
6
Rev 1.0, 2012-09-01
ITS4300S-SJ-D
General Product Characteristics
4.2
Functional Range
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
This thermal data was generated in accordance to JEDEC JESD51 standards.
More information on www.jedec.org
Table 2
Functional Range
Parameter
Symbol
Values
Unit
Note /
Test Condition
Number
Min.
Typ.
Max.
Nominal Operating Voltage
V
S
534
V
V
S increasing
4.2.1
Table 3
Thermal Resistance1)
1) Not subject to production test, specified by design
Parameter
Symbol
Values
Unit Note /
Test Condition
Number
Min.
Typ.
Max.
Thermal Resistance - Junction to
pin5
R
thj-pin5
34.5
K/W
4.3.1
Thermal Resistance - Junction to
Ambient - 1s0p, minimal footprint
R
thJA_1s0p
145
K/W 2)
2) Specified
R
thJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, footprint; the Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.
4.3.2
Thermal Resistance - Junction to
Ambient - 1s0p, 300mm2
R
thJA_1s0p_300mm
89
K/W 3)
3) Specified
R
thJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, Cu, 300mm
2; the Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.
4.3.3
Thermal Resistance - Junction to
Ambient - 1s0p, 600mm2
R
thJA_1s0p_600mm
78
K/W 4)
4) Specified
R
thJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, 600mm
2; the Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.
4.3.4
Thermal Resistance - Junction to
Ambient - 2s2p
R
thJA_2s2p
85
K/W 5)
5) Specified
R
thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; the Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
4.3.5
Thermal Resistance - Junction to
Ambient with thermal vias - 2s2p
R
thJA_2s2p
60.4
K/W 6)
6) Specified
R
thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board with two thermal vias;
the Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2
x 35µm Cu. The diameter of the two vias are equal 0.3mm and have a plating of 25um with a copper heatsink area of 3mm
x 2mm). JEDEC51-7: The two plated-through hole vias should have a solder land of no less than 1.25 mm diameter with a
drill hole of no less than 0.85 mm diameter.
4.3.6


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