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ADS5204 Datasheet(PDF) 2 Page - Texas Instruments

Part No. ADS5204
Description  DUAL 10 BIT 40MSPS LOW POWER ANALOG TO DIGITAL CONVERTER WITH PGA
Download  18 Pages
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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ADS5204 Datasheet(HTML) 2 Page - Texas Instruments

 
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ADS5204
SBAS268A – JUNE 2002 – REVISED JULY 2002
www.ti.com
2
ORDERING INFORMATION
PRODUCT
PACKAGE–LEAD
PACKAGE
DESIGNATOR(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
ADS5204
TQFP–48
PFB
–40
°C to +85°C
AZ5204
ADS5204IPFB
Tray, 250
ADS5204
TQFP–48
PFB
–40
°C to +85°C
AZ5204
ADS5204IPFBR
Tape and Reel, 1000
(1) For the most current specifications and package information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1).
Supply Voltage: AVDD to AGND, DVDD to DGND
–0.5V to 3.6V
. . . . . . . . . .
Supply Voltage: AVDD to DVDD, AGND to DGND
–0.5V to 0.5V
. . . . . . . . . .
Digital Input Voltage Range to DGND
–0.5V to DVDD + 0.5V
. . . . . . . . . . . .
Analog Input Voltage Range to AGND
–0.5V to AVDD + 0.5V
. . . . . . . . . . . . .
Digital Output Voltage Applied from Ext. Source to DGND
–0.5V to DVDD + 0.5V
. . . . .
Reference Voltage Input Range to AGND: VREFT, VREFB
–0.5V to AVDD + 0.5V
. . . . .
Operating Free–Air Temperature Range, TA (ADS5204I)
–40
°C to +85°C
. .
Storage Temperature Range, TSTG
–65
°C to +150°C
. . . . . . . . . . . . . . . . . .
Soldering Temperature 1.6mm (1/16 inch) from case for 10 seconds
300
°C
. . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage. Exposure to
absolute maximum conditions for extended periods may degrade device
reliability. These are stress ratings only, and functional operation of the device
at these or any other conditions beyond those specified is not implied.
This integrated circuit can be damaged by ESD.
Texas Instruments recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range, TA, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
NOM
MAX
UNIT
Power Supply
AVDD
Supply Voltage
DVDD
3.0
3.3
3.6
V
Su
ly Voltage
DRVDD
3.0
3.3
3.6
Analog and Reference Inputs
Reference Input Voltage (top)
VREFT
fCLK = 1MHz to 80MHz
1.9
2.0
2.15
V
Reference Input Voltage (bottom)
VREFB
fCLK = 1MHz to 80MHz
0.95
1.0
1.1
V
Reference Voltage Differential
VREFT – VREFB
fCLK = 1MHz to 80MHz
0.95
1.0
1.1
V
Reference Input Resistance
RREF
fCLK = 80MHz
1650
Reference Input Current
IREF
fCLK = 80MHz
0.62
mA
Analog Input Voltage, Differential
VIN
–1
1
V
Analog Input Voltage, Single–Ended(1)
VIN
CML – 1.0
CML + 1.0
V
Analog Input Capacitance
CI
8
pF
Clock Input(2)
0
AVDD
V
Analog Outputs
CML Voltage
AVDD/2
V
CML Output Resistance
2.3
k
Digital Inputs
High-Level Input Voltage
VIH
2.4
DVDD
V
Low-Level Input Voltage
VIL
DGND
0.8
V
Input Capacitance
5
pF
Clock Period
tc (80MHz)
12.5
ns
Pulse Duration
tw(CLKH), tw(CLKL) (80MHz)
Clock HIGH or LOW
5.25
ns
Clock Period
tc (40MHz)
25
ns
Pulse Duration
tw(CLKH) , tw(CLKL) (40MHz)
Clock HIGH or LOW
11.25
ns
(1) Applies only when the signal reference input connects to CML.
(2) Clock pin is referenced to AVDD/AVSS.


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