NCP163

www.onsemi.com

2

Figure 2. Simplified Schematic Block Diagram

IN

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

INTEGRATED

SOFT−START

BANDGAP

REFERENCE

ENABLE

LOGIC

EN

OUT

GND

EN

* ACTIVE DISCHARGE

Version A only

PIN FUNCTION DESCRIPTION

Pin No.

WLCSP4

Pin No.

XDFN4

Pin

Name

Description

A1

4

IN

Input voltage supply pin

A2

1

OUT

Regulated output voltage. The output should be bypassed with small 1

mF ceramic capacitor.

B1

3

EN

B2

2

GND

Common ground connection

−

EPAD

EPAD

Expose pad can be tied to ground plane for better power dissipation

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

−0.3 V to

6

V

Output Voltage

V

Chip Enable Input

V

Output Short Circuit Duration

unlimited

s

Maximum Junction Temperature

150

°C

Storage Temperature

−55 to 150

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

ESD Capability, Charged Device Model (Note 2)

1000

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Machine Model tested per EIA/JESD22−A115

ESD Charged Device Model tested per EIA/JESD22−C101, Field Induced Charge Model

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, WLCSP4 (Note 3), Thermal Resistance, Junction−to−Air

108

°C/W

Thermal Characteristics, XDFN4 (Note 3), Thermal Resistance, Junction−to−Air

198.1

3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7