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SST12LF09 Datasheet(PDF) 5 Page - Microchip Technology |
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SST12LF09 Datasheet(HTML) 5 Page - Microchip Technology |
5 / 18 page 2013 Microchip Technology Inc. DS75083B-page 5 SST12LF09 5.0 ELECTRICAL SPECIFICATIONS The DC and RF specifications for the power amplifier are specified below. Refer to Table 5-2 for the DC volt- age and current specifications. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi- mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func- tional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Tx input power to pin 5 (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Rx input power to pin 16 (ANT with LNA ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Average Tx output power from pin 16 (ANT)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +26 dBm 1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the maximum rating of average output power could cause permanent damage to the device. Supply Voltage at pins 3 and 4 (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +5.5V PA Enable Voltage to pin 6 (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V DC supply current (ICC)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA 2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds TABLE 5-1: OPERATING RANGE Range Ambient Temp VCC Extended -40°C to +85°C 3.0-5.0V TABLE 5-2: DC ELECTRICAL CHARACTERISTICS AT 25°C FOR TX CHAIN Symbol Parameter Min. Typ Max. Unit VCC Supply Voltage, VCC 3.0 3.6 5.0 V ICQ Tx Idle current for VCC = 3.6V 90 mA Tx Idle current for VCC = 5.0V 95 mA VPEN Tx Enable Voltage 3.05 3.10 3.15 V ICC Tx Supply Current for 11g OFDM 54 Mbps signal: POUT = 17 dBm at VCC = 3.6V 150 mA POUT = 18 dBm at VCC = 5.0V 160 mA IDD Rx Supply Current (with LNA ON) 9mA |
Similar Part No. - SST12LF09_13 |
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Similar Description - SST12LF09_13 |
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