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RN1723 Datasheet(PDF) 8 Page - Microchip Technology

Part # RN1723
Description  2.4 GHz IEEE Std. 802.11 b/g Wireless LAN Module
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

RN1723 Datasheet(HTML) 8 Page - Microchip Technology

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RN1723
DS70005224A-page 8
 2015 Microchip Technology Inc.
1.4
Soldering Recommendations
The RN1723 wireless module was assembled using
the IPC/JEDEC J-STD-020 Standard lead-free reflow
profile. However, the RN1723 module can be soldered
to the host PCB using standard leaded and lead-free
solder reflow profiles.
To avoid damaging the module, it is recommended to
adhere to the following:
• Solder reflow recommendations are provided in
the Microchip application note, AN233 “Solder
Reflow Recommendation” (DS00233)
• Do not exceed a peak temperature (TP) of 250°C
• Refer to the vendor’s solder paste data sheet for
specific reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash, as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.


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