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SN10503D Datasheet(PDF) 2 Page - Texas Instruments |
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SN10503D Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 23 page  SN10501 SN10502 SN10503 SLOS408A − MARCH 2003 − REVISED DECEMBER 2003 www.ti.com 2 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Supply voltage, VS 18 V Input voltage, VI ±VS Output current, IO (2) 150 mA Differential input voltage, VID 4 V Continuous power dissipation See Dissipation Rating Table Maximum junction temperature, TJ(3) 150 °C Maximum junction temperature, continuous operation, longterm reliability, TJ(4) 125 °C Operating free-air temperature range, TA −40 °C to 85°C Storage temperature range, Tstg −65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The SN1050x may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. (3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. (4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE DISSIPATION RATINGS PACKAGE ΘJC ΘJA(1) POWER RATING(2) PACKAGE ΘJC ( °C/W) ΘJA(1) ( °C/W) TA ≤ 25°C TA = 85°C DBV (5) 55 255.4 391 mW 156 mW D (8) 38.3 97.5 1.02 W 410 mW D (14) 26.9 66.6 1.5 W 600 mW DGK (8) 54.2 260 385 mW 154 mW DGN (8) 4.7 58.4 1.71 W 685 mW PWP (14) 2.07 37.5 2.67 W 1.07 W (1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and long term reliability. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Supply voltage, Dual supply ±1.35 ±9 Supply voltage, (VS+ and VS−) Single supply 2.7 18 V Input common-mode voltage range VS− + 1.1 VS+ − 1.1 V PACKAGE/ORDERING INFORMATION TEMPERATURE PACKAGED DEVICES PACKAGE TYPE TRANSPORT TEMPERATURE SINGLE DUAL TRIPLE PACKAGE TYPE TRANSPORT MEDIA, QUANTITY SN10501DBVT −−− −−− SOT−23−5 Tape and Reel, 250 SN10501DBVR −−− −−− SOT−23−5 Tape and Reel, 3000 SN10501DGK SN10502DGK −−− MSOP−8 Rails, 75 SN10501DGKR SN10502DGKR −−− MSOP−8 Tape and Reel, 2500 −40 °C to 85°C SN10501DGN SN10502DGN −−− MSOP−8−PP Rails, 75 −40 °C to 85°C SN10501DGNR SN10502DGNR −−− MSOP−8−PP Tape and Reel, 2500 SN10501D SN10502D SN10503D SOIC Rails, 75 SN10501DR SN10502DR SN10503DR SOIC Tape and Reel, 2500 −−− −−− SN10503PWP TSSOP−14−PP Rails, 75 −−− −−− SN10503PWPR TSSOP−14−PP Tape and Reel, 2000 |
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