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TXS0206-29 Datasheet(PDF) 1 Page - Texas Instruments |
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TXS0206-29 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 27 page YFP PACKAGE (TOP VIEW) D E A 1 2 3 4 B C TXS0206-29 www.ti.com SCES690 – DECEMBER 2009 MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER AND LDO VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING 1 FEATURES • Level Translator • ESD Protection Exceeds JESD 22 (A Port) – VCCA Range of 1.1 V to 3.6 V – 2000-V Human-Body Model (A114-B) – Fast Propagation Delay (4 ns Max When – 1000-V Charged-Device Model (C101) Translating Between 1.8 V and 2.9 V) • ±8-kV Contact Discharge IEC 61000-4-2 ESD • Low-Dropout (LDO) Regulator (B Port) – 200-mA LDO Regulator With Enable – 2.9-V Output Voltage – 3.05-V to 5.5-V Input Voltage Range – Very Low Dropout: 200 mV at 200 mA TERMINAL ASSIGNMENTS 1 2 3 4 A DAT2A VCCA WP/CD DAT2B B DAT3A VBATT VCCB O/P DAT3B C CMDA GND GND CMDB D DAT0A CLKA CLKB DAT0B E DAT1A CLK-f EN DAT1B DESCRIPTION/ORDERING INFORMATION The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry. The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to 3.6 V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V. Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side. Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) –40°C to 85°C WCSP – YFP (Pb-free) Tape and reel TXS0206-29YFPR _ _ _ 3 V 2 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) The actual top-side marking has three preceding characters to denote year, month, and sequence code. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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