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IS42VS83200J Datasheet(PDF) 2 Page - Integrated Silicon Solution, Inc

Part # IS42VS83200J
Description  32Mx8, 16Mx16, 8Mx32 256Mb Synchronous DRAM
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Manufacturer  ISSI [Integrated Silicon Solution, Inc]
Direct Link  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS42VS83200J Datasheet(HTML) 2 Page - Integrated Silicon Solution, Inc

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Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
2/5/2015
IS42VS83200J / IS42VS16160J / IS42VS32800J
General Description
ISSI’s 256Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 1.8V Vdd/
Vddq memory systems containing 268,435,456 bits. Internally configured as a quad-bank DRAM with a synchronous
interface. The 256Mb SDRAM includes an AUTO REFRESH MODE, and a power-saving, power-down mode. All
signals are registered on the positive edge of the clock signal, CLK. All inputs and outputs are LVCMOS (VDD =
1.8V) compatible. The 256Mb SDRAM has the ability to synchronously burst data at a high data rate with automatic
column-address generation, the ability to interleave between internal banks to hide precharge time and the capability
to randomly change column addresses on each clock cycle during burst access.
A self-timed row precharge initiated at the end of the burst sequence is available with the AUTO PRECHARGE
function enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles
and provide seamless, high-speed, random-access operation. SDRAM read and write accesses are burst oriented
starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The
registration of an Active command begins accesses, followed by a Read or Write command. The ACTIVE command
in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1 select the
bank; A0-A12 (x8 and x16) and A0-A11 (x32) select the row). The READ or WRITE commands in conjunction with
address bits registered are used to select the starting column location for the burst access. Programmable READ or
WRITE burst lengths consist of 1, 2, 4 and 8 locations, or full page, with a burst terminate option.
CLK
CKE
CS
RAS
CAS
WE
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
A10
A12
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
REFRESH
CONTROLLER
REFRESH
COUNTER
SELF
REFRESH
CONTROLLER
ROW
ADDRESS
LATCH
COLUMN
ADDRESS LATCH
BURST COUNTER
COLUMN
ADDRESS BUFFER
COLUMN DECODER
DATA IN
BUFFER
DATA OUT
BUFFER
DQML
DQMH
DQ 0-15
VDD/VDDQ
Vss/VssQ
13
13
9
13
13
9
16
16
16
16
512
(x 16)
8192
8192
8192
8192
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
BANK CONTROL LOGIC
ROW
ADDRESS
BUFFER
A11
2
FUNCTIONAL BLOCK DIAGRAM (FOR 16Mx16 BANKS SHOWN)


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