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LM129 Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM129
Description  Precision Reference
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM129 Datasheet(HTML) 3 Page - National Semiconductor (TI)

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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
(Note 3)
Reverse Breakdown Current
30 mA
Forward Current
2 mA
Operating Temperature Range
LM129
−55˚C to +125˚C
LM329
0˚C to +70˚C
Storage Temperature Range
−55˚C to +150˚C
Soldering Information
TO-92 package: 10 sec.
260˚C
TO-46 package: 10 sec.
300˚C
Electrical Characteristics (Note 2)
LM129A, B, C
LM329A, B, C, D
Parameter
Conditions
Units
Min
Typ
Max
Min
Typ
Max
Reverse Breakdown Voltage
T
A = 25˚C,
0.6 mA
≤ I
R ≤ 15 mA
6.7
6.9
7.2
6.6
6.9
7.25
V
Reverse Breakdown Change
T
A = 25˚C,
with Current (Note 4)
0.6 mA
≤ I
R ≤ 15 mA
9
14
9
20
mV
Reverse Dynamic Impedance
T
A = 25˚C, IR = 1 mA
0.6
1
0.8
2
(Note 4)
RMS Noise
T
A = 25˚C,
10 Hz
≤ F ≤ 10 kHz
7
20
7
100
µV
Long Term Stability
T
A = 45˚C ± 0.1˚C,
(1000 hours)
I
R =1 mA ± 0.3%
20
20
ppm
Temperature Coefficient
I
R =1 mA
LM129A, LM329A
6
10
6
10
ppm/˚C
LM129B, LM329B
15
20
15
20
ppm/˚C
LM129C, LM329C
30
50
30
50
ppm/˚C
LM329D
50
100
ppm/˚C
Change In Reverse Breakdown
1 mA
≤ I
R ≤ 15 mA
1
1
ppm/˚C
Temperature Coefficient
Reverse Breakdown Change
1 mA
≤ I
R ≤ 15 mA
12
12
mV
with Current
Reverse Dynamic Impedance
1 mA
≤ I
R ≤ 15 mA
0.8
1
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Note 2: These specifications apply for −55˚C
≤ TA ≤ +125˚C for the LM129 and 0˚C ≤ TA ≤ +70˚C for the LM329 unless otherwise specified. The maximum junction
temperature for an LM129 is 150˚C and LM329 is 100˚C. For operating at elevated temperature, devices in TO-46 package must be derated based on a thermal re-
sistance of 440˚C/W junction to ambient or 80˚C/W junction to case. For the TO-92 package, the derating is based on 180˚C/W junction to ambient with 0.4" leads
from a PC board and 160˚C/W junction to ambient with 0.125" lead length to a PC board.
Note 3: Refer to RETS129H for LM129 family military specifications.
Note 4: These changes are tested on a pulsed basis with a low duty-cycle. For changes versus temperature, compute in terms of tempco.
www.national.com
3


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